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Quectel FME164Q M.2 Adapter | Wi-Fi 6 & BT5.3, Up to 1774.5 Mbps Throughput

Quectel FME164Q M.2 Adapter | Wi-Fi 6 & BT5.3, Up to 1774.5 Mbps Throughput

Brand Name: Quectel
Model Number: FME164Q
MOQ: 1
Price: Negotiation
Detail Information
Place of Origin:
OEM
Packaging Details:
New original box
Highlight:

Quectel FME164Q M.2 Adapter

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Wi-Fi 6 BT5.3 adapter

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1774.5 Mbps M.2 adapter

Product Description
Product Overview

The Quectel FME164Q is a high-performance Wi-Fi 6 and Bluetooth 5.3 module designed for devices that require fast, stable, and efficient short-range wireless connectivity. Built on a Wi-Fi 6 architecture, it supports dual-band operation and advanced wireless features that improve throughput, responsiveness, and connection reliability in crowded or dynamic network environments.

Presented in a compact M.2 2230 KEY-E form factor (22.0 mm × 30.0 mm × 4.0 mm), the module is easy to integrate into laptops, industrial PCs, embedded gateways, routers, smart displays, and other host platforms that support M.2 expansion. Its small footprint helps save board space while still delivering the performance needed for modern applications such as video streaming, cloud collaboration, file transfer, remote management, and real-time device control.

Key Features
  • 2.4 GHz and 5 GHz Wi-Fi bands with Bluetooth 5.3
  • Dual band simultaneous (DBS) operation
  • PCIe 3.0 interface supporting higher data transmission rates and lower power consumption
  • Fast time-to-market: simple design minimizes design-in time and development effort
  • Wide operating temperature range: −30 °C to +65 °C
  • Multi-link operation (MLO) enabling several links between Wi-Fi 6 devices over a single channel
  • Each channel supports up to 1024 QAM
  • 2 × 2 + 2 × 2 MIMO with dual band simultaneous (DBS)
  • Maximum physical layer data transmission rate of 1774.5 Mbps
Technical Specifications
Wireless Standard Wi-Fi 6 (802.11ax) and Bluetooth 5.3
Frequency Bands 2.4 GHz and 5 GHz (dual band simultaneous)
Maximum Throughput Up to 1774.5 Mbps (physical layer)
MIMO Configuration 2 × 2 + 2 × 2 MIMO
Modulation Up to 1024 QAM per channel
Host Interface PCIe 3.0
Form Factor M.2 2230 KEY-E
Dimensions 22.0 mm × 30.0 mm × 4.0 mm
Operating Temperature −30 °C to +65 °C
Multi-Link Operation Supported (MLO)
Performance & Connectivity

The FME164Q supports simultaneous dual-band operation, allowing devices to make better use of available spectrum and maintain more consistent wireless performance. With Wi-Fi 6 capabilities, it handles multiple connections more efficiently, reducing congestion and improving the overall network experience in environments with many active devices. Bluetooth 5.3 adds flexible low-energy connectivity for peripherals, sensors, wearables, audio accessories, and mobile app pairing.

With support for multi-link operation (MLO), the FME164Q enables several links between Wi-Fi 6 devices to be transmitted and received over a single channel, with each channel supporting up to 1024 QAM. It operates simultaneously on 2.4 GHz and 5 GHz, and supports 2 × 2 + 2 × 2 MIMO and DBS, delivering a maximum physical layer data transmission rate of 1774.5 Mbps.

Power Efficiency & Environmental Durability

Based on a reliable PCIe 3.0 interface, the FME164Q achieves low-power and high-speed data transmission. Coupled with higher power consistency and accuracy and an ultra-wide temperature range, the module meets the requirements of industrial, consumer goods, and laptop applications.

Its wide operating temperature range further supports deployment in industrial, commercial, and consumer scenarios where environmental conditions may vary. This makes it suitable for products that require sustained wireless performance without excessive thermal or power overhead.

Target Applications

The Quectel FME164Q is an ideal choice for developers who want to upgrade host devices with modern Wi-Fi 6 and Bluetooth 5.3 connectivity through a compact M.2 interface. By combining high throughput, dual-band stability, and low-energy Bluetooth into a single module, it helps simplify wireless design and accelerate the development of faster, more responsive connected products.

  • Laptops and mobile computing devices
  • Industrial PCs and embedded gateways
  • Routers and networking equipment
  • Smart displays and interactive terminals
  • Consumer electronics requiring high-speed wireless connectivity