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Quectel FC909A Wireless Combo Module | 72Mbps Wi-Fi 4 & BLE 5.2

Quectel FC909A Wireless Combo Module | 72Mbps Wi-Fi 4 & BLE 5.2

Brand Name: Quectel
Model Number: FC909A
MOQ: 1
Price: Negotiation
Detail Information
Place of Origin:
OEM
Packaging Details:
New original box
Highlight:

Quectel FC909A Wireless Combo Module

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72Mbps Wi-Fi 4 Module

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BLE 5.2 Wireless Module

Product Description
Product Overview

The Quectel FC909A is a high-performance wireless combo module integrating Wi-Fi 4 (802.11b/g/n) and Bluetooth Low Energy 5.2 in a single, ultra-compact LCC package. Measuring only 12.0mm * 12.0mm * 1.95mm, it is engineered to optimize both size and cost in space-constrained IoT designs.

By consolidating two widely used wireless technologies into one module, the FC909A simplifies product architecture, reduces routing complexity, and accelerates time-to-market. It is an ideal choice for developers who need a practical, space-efficient wireless solution supporting both network connectivity and close-range device interaction in everyday IoT applications.

Key Features
  • Single-band 2.4 GHz Wi-Fi 4 (802.11b/g/n) and Bluetooth 5.2 (BLE) connectivity
  • SDIO 2.0 interface supporting higher data rates and lower power consumption
  • Ultra-compact LCC package: 12.0mm * 12.0mm * 1.95mm
  • Integrated Power Management Units (PMUs), Power Amplifiers (PA), and Low Noise Amplifiers (LNA)
  • Bluetooth Class 1 power amplifier for extended range
  • Supports Extended Synchronous Connection Oriented Link (eSCO) for improved voice quality
  • Adaptive Frequency Hopping (AFH) technology to reduce RF interference
  • Wide operating temperature range: −30°C to +85°C
  • Surface Mount Technology (SMT) compatible for durable, robust designs
  • Advanced packaging with laser engraving tags for improved thermal dissipation and durable marking
Technical Specifications
Wireless Standard Wi-Fi 4 (802.11b/g/n), Bluetooth 5.2 (BLE)
Frequency Band 2.4 GHz single-band
Wi-Fi Data Rate Up to 72 Mbps
Host Interface SDIO 2.0
Package Type LCC (Leadless Chip Carrier)
Dimensions 12.0mm * 12.0mm * 1.95mm
Operating Temperature −30°C to +85°C
Integrated Components PMU, PA, LNA, Bluetooth Class 1 PA
Bluetooth Features eSCO, Adaptive Frequency Hopping (AFH)
Mounting Surface Mount Technology (SMT)
Design Advantages

The FC909A is designed to minimize design import time and development workload, enabling faster time to market. Its integrated architecture reduces routing complexity and shortens the hardware development cycle.

The low-profile, small-size LCC packaging allows the module to be easily embedded in size-constrained applications while providing reliable connectivity. Advanced packaging and laser engraving tags with improved thermal dissipation performance and durable marking meet the demands of large-scale automation production with stringent cost and efficiency requirements.

Application Scenarios

The FC909A is especially suitable for applications where space, cost, and power consumption must be carefully balanced. Its combination of Wi-Fi and BLE allows products to operate in multiple modes, including network-connected operation, local Bluetooth control, hybrid provisioning, and remote maintenance.

  • Smart home appliances
  • Environmental sensors
  • Smart lighting systems
  • Energy monitoring devices
  • Consumer electronics
  • Health and wellness products
  • Small retail terminals
  • Embedded modules requiring dual wireless access
Connectivity & Use Cases

Wi-Fi 4 support enables dependable connection to existing wireless networks, allowing devices to communicate with servers, gateways, and local controllers in homes, offices, retail environments, and light industrial settings. Bluetooth Low Energy 5.2 adds flexible short-range interaction, making it convenient for users to configure devices through mobile apps, pair with nearby sensors, or manage device settings without relying solely on network infrastructure.

Developers can use the FC909A to build products that need stable local wireless communication, app-based control, remote configuration, firmware updates, and cloud data reporting — all from a single, compact module.