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Quectel FC20 Series Cost-effective Wi-Fi & Bluetooth IoT Module

Quectel FC20 Series Cost-effective Wi-Fi & Bluetooth IoT Module

Brand Name: Quectel
Model Number: FC20 Series
MOQ: 1
Price: Negotiation
Detail Information
Place of Origin:
OEM
Packaging Details:
New original box
Highlight:

Quectel FC20 Wi-Fi Bluetooth Module

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Cost-effective IoT Wi-Fi Module

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FC20 Series Bluetooth IoT Module

Product Description
Product Overview

The Quectel FC20 Series is a cost-effective Wi-Fi and Bluetooth module designed for IoT applications that require reliable short-range wireless connectivity without unnecessary hardware complexity. It provides an efficient way to connect smart devices to local networks, mobile apps, cloud platforms, and nearby accessories, making it suitable for a wide range of consumer, commercial, and light industrial products.

Built around a low-power architecture, the FC20 Series helps extend device runtime and reduce thermal pressure in compact designs. This makes it especially suitable for battery-powered or always-on devices where energy efficiency, stable operation, and long-term reliability are important. The module supports dual-mode Bluetooth, enabling flexible communication with smartphones, wearables, sensors, and other peripheral devices, while Wi-Fi connectivity allows seamless integration into existing wireless networks.

Key Features
  • Supports Bluetooth 5.0 for flexible short-range communication
  • Supports IEEE 802.11a/b/g/n/ac Wi-Fi standards
  • LCC packaging simplifies the welding and testing process
  • Stable and reliable SDIO communication interface
  • Quick go-to-market: simple design minimizes design import time and development workload
  • Ultra-compact dimensions: 16.6 mm × 13.0 mm × 2.05 mm
  • Surface mounting technology (SMT) for durable and robust designs
  • Low power consumption with extended temperature range support
  • Two models available (FC20 and FC20-N) to suit different application scenarios
Technical Specifications
Wireless Standard IEEE 802.11a/b/g/n/ac (Wi-Fi) + Bluetooth 5.0
Package Type LCC (Leadless Chip Carrier)
Dimensions 16.6 mm × 13.0 mm × 2.05 mm
Communication Interface SDIO
Mounting Technology Surface Mount Technology (SMT)
Available Models FC20, FC20-N
Power Architecture Low-power design for extended device runtime
Design Advantages

One of the key strengths of the FC20 Series is its ability to simplify product development. By integrating wireless communication, protocol support, and application processing into a single module, it reduces the need for additional controllers in many lightweight IoT scenarios. Developers can focus on application logic, user experience, and cloud integration instead of spending excessive time on complex hardware design.

The FC20 Series combines the advantages of compact dimensions, low power consumption, extended temperature ranges, and stable SDIO interfaces. It is typically paired with Quectel LTE standard modules such as the EC21 series, EC25 series, EC20-CE, and EG25-G, as well as other application processors (IMX6, IMX8, etc.) for a wide range of M2M applications.

Advanced packaging technology supports cost and efficiency requirements for highly automated mass production, making the FC20 Series an ideal solution for durable and robust designs.

Target Applications

The module is well suited for a broad range of applications, including:

  • Automotive
  • Smart Security
  • Industrial PDAs
  • MiFi Devices
  • Healthcare
  • Smart Home Appliances
  • Lighting Control Systems
  • Environmental Sensors
  • Smart Plugs
  • Health & Wellness Products
  • Retail Terminals
  • Industrial Monitoring Nodes
Why Choose the FC20 Series

The Quectel FC20 Series is an ideal choice for product teams that want to add dependable Wi-Fi and Bluetooth connectivity to IoT devices in a cost-efficient way. It balances performance, power consumption, and integration simplicity, helping developers bring smart connected products to market faster and with greater confidence. Its compact size and flexible interface options make it easier to embed into space-constrained enclosures while maintaining stable wireless performance.