| Brand Name: | Quectel |
| Model Number: | FCM740D |
| MOQ: | 1 |
| Price: | Negotiation |
The Quectel FCM740D is an embedded MCU module that combines a capable processor, Wi-Fi 4, and Bluetooth Low Energy 5.2 into one compact wireless solution. Designed for small, cost-sensitive, and power-conscious IoT products, it allows developers to implement local control, network connectivity, and app-based interaction without relying on multiple discrete components.
At its core, the module integrates a high-performance MCU that can handle application logic, protocol processing, and peripheral management directly. This makes it especially suitable for devices that need more than basic connectivity but do not require a full application processor. With built-in memory and a streamlined software stack, the FCM740D supports efficient development through standard AT commands and the QuecOpen solution, giving teams flexibility in how they implement device behavior.
| Processor | High-performance MCU, master frequency up to 120MHz |
|---|---|
| Wireless Standards | IEEE 802.11b/g/n (Wi-Fi 4), Bluetooth Low Energy 5.2 |
| Antenna | PCB antenna or first RF coaxial connector, 1*1 |
| Memory | 256KB SRAM, 2MB or 4MB flash |
| Security | WPA-PSK, WPA2-PSK, WPA3-SAE |
| Package | LCC + DIP |
| Dimensions | 20.3mm * 15.8mm * 2.7mm |
| Default Interfaces | UART, GPIO |
| Multiplexed Interfaces | PWM, SPI, I2C, ADC |
| Operating Temperature | -40°C to +105°C |
| Software Support | QuecOpen solution, standard AT commands |
Wi-Fi 4 support enables stable connection to local wireless networks, while BLE 5.2 adds convenient short-range interaction for provisioning, mobile app control, and nearby device pairing. The module also supports multiple low-power modes and keep-alive mechanisms, helping battery-powered or always-on devices maintain reliable operation without excessive energy consumption.
The FCM740D comes in an LCC + DIP package, measuring only 20.3mm * 15.8mm * 2.7mm, optimizing the size and cost of the end product while remaining compatible with a variety of designs. Its LCC + DIP packaging supports both surface-mount and wave-soldering processes, making it easier to integrate into diverse production workflows.
The compact footprint is particularly well suited for space-limited products such as smart lighting, smart sockets, sensors, small appliances, consumer electronics, and lightweight industrial nodes. A wide operating temperature range further enhances its suitability for environments where thermal stability matters.
The Quectel FCM740D is an ideal choice for product teams seeking a practical embedded MCU module with integrated Wi-Fi and Bluetooth. By merging processing capability and wireless connectivity into a single small form factor, it helps simplify hardware design, reduce component count, and accelerate the development of reliable, everyday IoT devices.