logo

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
IGBT Power Module
Created with Pixso.

Quectel FCM740D Embedded MCU Module | 120MHz Core, Wi-Fi 4 & BLE 5.2

Quectel FCM740D Embedded MCU Module | 120MHz Core, Wi-Fi 4 & BLE 5.2

Brand Name: Quectel
Model Number: FCM740D
MOQ: 1
Price: Negotiation
Detail Information
Place of Origin:
OEM
Packaging Details:
New original box
Highlight:

Quectel FCM740D Embedded MCU Module

,

120MHz MCU Module with Wi-Fi 4

,

BLE 5.2 Embedded MCU Module

Product Description
Product Overview

The Quectel FCM740D is an embedded MCU module that combines a capable processor, Wi-Fi 4, and Bluetooth Low Energy 5.2 into one compact wireless solution. Designed for small, cost-sensitive, and power-conscious IoT products, it allows developers to implement local control, network connectivity, and app-based interaction without relying on multiple discrete components.

At its core, the module integrates a high-performance MCU that can handle application logic, protocol processing, and peripheral management directly. This makes it especially suitable for devices that need more than basic connectivity but do not require a full application processor. With built-in memory and a streamlined software stack, the FCM740D supports efficient development through standard AT commands and the QuecOpen solution, giving teams flexibility in how they implement device behavior.

Key Features
  • Wi-Fi 4 module with single-band (2.4GHz) Wi-Fi and 1*1 antenna
  • PCB antenna or first RF coaxial connector
  • BLE 5.2 with Wi-Fi pairing via Bluetooth
  • High-capacity memory: 256KB SRAM and 4MB flash
  • Wide operating temperature range: -40°C to +105°C
  • High stability, high reliability, and full compatibility
Technical Specifications
Processor High-performance MCU, master frequency up to 120MHz
Wireless Standards IEEE 802.11b/g/n (Wi-Fi 4), Bluetooth Low Energy 5.2
Antenna PCB antenna or first RF coaxial connector, 1*1
Memory 256KB SRAM, 2MB or 4MB flash
Security WPA-PSK, WPA2-PSK, WPA3-SAE
Package LCC + DIP
Dimensions 20.3mm * 15.8mm * 2.7mm
Default Interfaces UART, GPIO
Multiplexed Interfaces PWM, SPI, I2C, ADC
Operating Temperature -40°C to +105°C
Software Support QuecOpen solution, standard AT commands
Connectivity & Power Management

Wi-Fi 4 support enables stable connection to local wireless networks, while BLE 5.2 adds convenient short-range interaction for provisioning, mobile app control, and nearby device pairing. The module also supports multiple low-power modes and keep-alive mechanisms, helping battery-powered or always-on devices maintain reliable operation without excessive energy consumption.

Design & Integration

The FCM740D comes in an LCC + DIP package, measuring only 20.3mm * 15.8mm * 2.7mm, optimizing the size and cost of the end product while remaining compatible with a variety of designs. Its LCC + DIP packaging supports both surface-mount and wave-soldering processes, making it easier to integrate into diverse production workflows.

The compact footprint is particularly well suited for space-limited products such as smart lighting, smart sockets, sensors, small appliances, consumer electronics, and lightweight industrial nodes. A wide operating temperature range further enhances its suitability for environments where thermal stability matters.

Applications
  • Smart home devices
  • Industrial IoT
  • Consumer electronics
  • Small, high-temperature IoT devices such as bulbs, lamp straps, and smart sockets
  • Sensors and lightweight industrial nodes
Why Choose the FCM740D

The Quectel FCM740D is an ideal choice for product teams seeking a practical embedded MCU module with integrated Wi-Fi and Bluetooth. By merging processing capability and wireless connectivity into a single small form factor, it helps simplify hardware design, reduce component count, and accelerate the development of reliable, everyday IoT devices.